Methods and apparatus for quantum point contacts in CMOS processes

ABSTRACT

Methods and apparatus for quantum point contacts. In an arrangement, a quantum point contact device includes at least one well region in a portion of a semiconductor substrate and doped to a first conductivity type; a gate structure disposed on a surface of the semiconductor substrate; the gate structure further comprising a quantum point contact formed in a constricted area, the constricted area having a width and a length arranged so that a maximum dimension is less than a predetermined distance equal to about 35 nanometers; a drain/source region in the well region doped to a second conductivity type opposite the first conductivity type; a source/drain region in the well region doped to the second conductivity type; a first and second lightly doped drain region in the at least one well region. Additional methods and apparatus are disclosed.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application claims priority to U.S. Provisional Patent ApplicationSer. No. 62/005,574 (attorney docket TI-67486PS), filed May 30, 2014,titled “CMOS Compatible Quantum Point Contact,” which application ishereby incorporated by reference herein in its entirety.

TECHNICAL FIELD

The arrangements of the present application relate generally tosemiconductor processing and in particular to structures and methodscompatible with MOS semiconductor processes for forming quantum pointcontacts.

BACKGROUND

Many circuits commonly used in commercial integrated circuits requireknown resistor values to serve as references to enable accuracy in thecircuit function. Example applications for accurate components includeoscillators, amplifiers, voltage regulators, current mirrors, currentsources, op-amps with feedback, etc. Current techniques for obtainingresistors with known values include screening resistor values, usingresistor deltas, using either mechanical or electrical trimming ofresistors in a post-production process, and the like. Exampleapplications include tuning and phase locking operations incommunications circuitry, current sources, current mirrors, biascurrents, and other applications using resistance.

Most resistors produced in semiconductor processes in known priorapproaches have an inherent dependence on temperature, and resistorsproduced in semiconductor processing also depend on process variations.Example resistors include polysilicon resistors and N well resistorsformed from N-type doped semiconductor material. These resistors havevalues that vary with temperature and with process variations. Manytechniques have been developed to modify the physical devices to reduceor compensate for temperature variation so the resistors can be used fora reference value or to generate a current from a voltage, for example.However, none of these is available to be incorporated into a practicalintegrated circuit. The need for accurate voltage and current sourcesleads to the fabrication of complex circuitry to overcome the prior artresistor temperature and process variations. A “PTAT” (proportional toabsolute temperature) circuit can be used in a ratio or divider circuit,with current mirrors and feedback amplifiers for example, to attempt toremove the temperature dependence from a current or voltage. A commoncircuit is a bandgap reference circuit for producing a reference voltageindependent of these variations. A resistor can be used to produce acurrent from the voltage output by a bandgap reference circuit. Theoutput current is simply the reference voltage divided by theresistance. However, even if the resistance temperature dependence iscompensated for by using a ratio or other operation to cancel out thetemperature dependent factors, the process variations remain and thereis no practical semiconductor process resistor available to date that isa fixed value over all expected process and temperature variations. Forexample, known prior resistors produced in semiconductor processes havevalue dependencies that vary with process steps such as lithography,deposition, and etching. The resistor values also depend on variablethin film properties such as film thickness, uniformity, andcomposition.

A known component with a conductivity value (the inverse of resistancevalue) that is a fixed quantity has been constructed using a quantumdevice. Quantum devices have been described in semiconductor processesat room temperature. For example, U.S. Patent Application PublicationNo. 2012/00098590, titled “Quantum Electro-Optical Device using CMOSTransistor with Reverse Polarity Drain Implant,” with inventors Edwardset. al., published Apr. 26, 2012, which is co-owned with the presentapplication and which is hereby incorporated by reference in itsentirety herein, describes forming a quantum device using a CMOSsemiconductor process. By creating a confinement quantum well of verysmall dimensions, e.g., between 5 and 15 nanometers, quantum operationscan be achieved in semiconductor material.

A quantum point contact exhibiting quantized conductance in a GaAssubstrate is described in a paper titled “Quantum Point Contacts—Thequantization of ballistic electron transport through a constrictiondemonstrates that conduction is transmission”, Physics Today, authoredby Henk van Houten and Carlo Beenakker, July 1996, at p. 22. In thisprior known approach, a heterojunction is formed between a GaAssubstrate and AlGaAs material and a constriction point is formed beneatha gate terminal. A 2D electron gas is formed on either side of theconstriction point. A gate conductor overlies the constriction point.When a constriction point for electron transport is similar in width tothe Fermi wavelength for the electrons, a quantum point contact isformed. In the paper, conductance (UV) was found for the quantum pointcontact that is quantized and proportional to the ratio 2e²/h, where eis the electron charge, and h is Planck's constant, inversely this formsa quantized resistance proportional to h/2e², or approximately 1/13kohms. This resistance has a value that depends only on physicalconstants and is not temperature or process dependent. A series of stepvalues corresponding to quantized conductance controlled by a gatevoltage is demonstrated in the paper at near zero temperatures. Theconductance is proportional only to 2 physical constants and so anaccurate and fixed value resistance or conductance component ispossible.

A continuing need thus exists for fixed and stable value passivecomponents such as resistors that can be formed within a currentcommercial MOS semiconductor process and which operate at roomtemperature and over commercially acceptable temperature ranges. Byfabricating the resistor devices along with MOS devices such astransistors, capacitors, diodes and the like in a single integratedcircuit device, control circuitry can be formed alongside and using theresistive devices, forming a commercially useful integrated circuit.Because the resistance will be accurate over temperature and processvariations, the need for complex temperature compensation circuitry andother temperature compensated resistor circuits can be reduced oreliminated, saving silicon area and reducing the size and complexity ofthe integrated circuits.

SUMMARY

The arrangements that form various aspects of the present applicationprovide a quantum point contact device that can be fabricated in a CMOSsemiconductor process. The arrangements include methods and apparatusfor providing quantum point contact devices by forming a constriction ofa quantum dimension in a channel for conducting electrons in order toachieve a quantized conductance between a drain region and a sourceregion. The quantum point contact device of the arrangements provides anaccurate conductance or an accurate resistance that operates at roomtemperatures and which is compatible with the simultaneous fabricationof MOS transistors, enabling arrangements where the quantum pointcontact devices are formed along with MOS transistors on an integratedcircuit.

In an example arrangement that forms an aspect of the presentapplication, a quantum point contact device comprises a semiconductorsubstrate; at least one well region in a portion of the semiconductorsubstrate and doped to a first conductivity type; a gate structuredisposed on a surface of the semiconductor substrate and overlying achannel region in the substrate, and further comprising a gatedielectric layer lying over the channel region and a gate conductormaterial overlying the gate dielectric; the gate structure furthercomprising a quantum point contact formed in a constricted area of thegate structure, the constricted area having a width and a lengtharranged so that a maximum dimension of the width and the length is lessthan a predetermined distance equal to about 35 nanometers; adrain/source region in the well region disposed spaced from one side ofthe channel region and doped to a second conductivity type opposite thefirst conductivity type; an source/drain region in the well regionspaced from the channel region on a side opposite the drain/sourceregion, the source/drain region doped to the second conductivity type; afirst lightly doped drain region in the at least one well region anddisposed between the drain/source region and the channel region; and asecond lightly doped drain region in the at least one well region anddisposed between the source/drain region and the channel region, thesecond lightly doped drain region.

In an example alternative arrangement that forms an aspect of thepresent application, a method for forming a quantum point contact deviceincludes providing a semiconductor substrate; implanting impurities inthe semiconductor substrate to form a well region doped to a firstconductivity type; depositing a gate dielectric over a surface of thesemiconductor substrate, depositing a gate conductor over the gatedielectric, and etching the gate conductor and the gate dielectric toform a gate structure overlying a channel region defined in a centralportion of the well region, the gate structure further comprising aconstricted area, the constricted area having a width and a lengtharranged so that a maximum dimension of the width and the length is lessthan a predetermined distance equal to about 35 nanometers; implantingimpurities to dope the semiconductor substrate to form a first lightlydoped drain region extending into the semiconductor substrate from thesurface and disposed on one side of the channel region; implantingimpurities to dope the semiconductor substrate to form a second lightlydoped drain region extending into the semiconductor substrate from thesurface on a side of the channel region opposite the first lightly dopeddrain region; implanting impurities to dope the semiconductor substrateto a second conductivity type to form a drain/source region extendingfrom the surface of the semiconductor substrate deeper than the firstlightly doped drain region, the drain/source region spaced from thechannel region by a portion of the first lightly doped drain region; andimplanting impurities to dope the semiconductor substrate to the secondconductivity type to form an source/drain region extending from thesurface into the semiconductor substrate deeper than the second lightlydoped drain region, the source/drain region spaced from the channelregion by a portion of the second lightly doped drain region.

In yet another arrangement that forms an additional aspect of thepresent application, an integrated circuit includes at least one quantumpoint contact device formed in a first well region in a semiconductorsubstrate that is doped to a first conductivity type, the quantum pointcontact device further comprising: a drain/source region in the firstwell region disposed spaced from one side of a channel region defined ina central portion of the well region, and doped to a second conductivitytype opposite the first conductivity type; an source/drain region in thefirst well region spaced from the channel region on a side opposite thedrain/source region, the source/drain region doped to the secondconductivity type; a first lightly doped drain region in the first wellregion and disposed between the drain/source region and the channelregion, the first lightly doped drain region doped to the secondconductivity type; a second lightly doped drain region in the first wellregion and disposed between the source/drain region and the channelregion, the second lightly doped drain region doped to the secondconductivity type; and a gate structure disposed on a surface of thesemiconductor substrate and overlying the channel region, the gatestructure comprising a gate dielectric layer lying over the channelregion and a gate conductor material overlying the gate dielectric, thegate structure further comprising a quantum point contact formed in aconstricted area, the constricted area having a width and a lengtharranged so that a maximum dimension of the width and the length is lessthan a predetermined distance equal to about 35 nanometers; wherein thequantum point contact further comprises a current path in the substratebeneath the constricted area of the gate structure, the current pathhaving a width of less than 20 nanometers; and at least one MOStransistor disposed in the first well region adjacent the quantum pointcontact device, and further comprising: a first source/drain region inthe first well region disposed spaced from one side of a MOS channelregion defined in a central portion of the first well region, and dopedto a second conductivity type opposite the first conductivity type; asecond source/drain region in the first well region disposed spaced fromanother side of the MOS channel region opposite the first source/drainregion, the second source/drain region doped to the first conductivitytype; a first MOS lightly doped drain region disposed between the firstsource/drain and the MOS channel region, the first MOS lightly dopeddrain region doped to the second conductivity type; a second MOS lightlydoped drain region disposed between the second source/drain region andthe MOS channel region, the second MOS lightly doped drain region dopedto the second conductivity type; and a MOS gate structure disposed on asurface of the semiconductor substrate and overlying the channel region,the MOS gate structure comprising a gate dielectric layer lying over thechannel region and a gate conductor material overlying the gatedielectric.

Recognition is made in the present application that a quantum pointcontact device can be fabricated in a MOS semiconductor process. Thearrangements provide quantum point contact devices having an accurateconductance between a drain and a source terminal, the conductance beingproportional to two physical constants and independent of temperatureand process variations, thereby providing accurate resistance elementsthat are compatible with semiconductor processes for integration withtransistors and other circuitry. Applications include amplifiers, analogand digital circuitry, reference current and bias current sources, andvarious circuitry applications where accurate value passive componentsare used or desired.

BRIEF DESCRIPTION OF THE DRAWINGS

For a more complete understanding of the illustrative examples ofaspects of the present application that are described herein and theadvantages thereof, reference is now made to the following descriptionstaken in conjunction with the accompanying drawings, in which:

FIG. 1 depicts a plan view of a layout for an example quantum pointcontact arrangement forming an aspect of the present application;

FIG. 2 illustrates a schematic symbol for a quantum point contactresistor arrangement such as the one illustrated in FIG. 1;

FIG. 3 illustrates in a top view a portion of a region in asemiconductor substrate including various diffusion regions forming aquantum point contact arrangement;

FIG. 4 is a graph of a potential diagram for a quantum point contactarrangement such as shown in FIG. 3;

FIG. 5 depicts in a projection the potential diagram for a quantum pointcontact arrangement such as shown in FIG. 3 in both the width and lengthdirections;

FIG. 6 depicts in a top view diagram an example layout arrangement forforming a quantum point contact device in a semiconductor processcompatible with MOS device fabrication;

FIG. 7 illustrates in a cross sectional view a portion of a quantumpoint contact arrangement such as the quantum point contact depicted inFIG. 6;

FIG. 8 illustrates in a further cross sectional view another portion ofa quantum point contact arrangement such as the quantum point contactdepicted in FIG. 6;

FIG. 9 depicts in a plan view an example arrangement for forming aquantum point contact depicting diffusion regions in a semiconductorsubstrate;

FIG. 10 depicts in a cross sectional view a first portion of anarrangement such as the one illustrated in FIG. 9 for forming a quantumpoint contact of the present application;

FIG. 11 depicts in a top view an alternative arrangement for a quantumpoint contact illustrating doped diffused regions;

FIG. 12 depicts in a cross sectional view a portion of the arrangementof FIG. 11;

FIG. 13 is the first in a series of cross-sectional views depicting thesuccessive processing steps used to manufacture a quantum point contactdevice using a CMOS semiconductor process;

FIG. 14 is a next step in the series depicting a cross-sectional view ofthe construction of a quantum point contact device such as the oneillustrated in FIG. 13 and forming a gate structure;

FIG. 15 is a next step in the series depicting a cross-sectional view ofthe construction of a quantum point contact device such as the oneillustrated in FIG. 14, illustrating a photoresist and ion implantation;

FIG. 16 is a next step in the series depicting a cross-sectional view ofthe construction of a quantum point contact device such as the oneillustrated in FIG. 15;

FIG. 17 is a next step in the series depicting a cross-sectional view ofthe construction of a quantum point contact device such as the oneillustrated in FIG. 16, illustrating gate sidewall formation;

FIG. 18 is a next step in the series depicting a cross-sectional view ofthe construction of a quantum point contact device such as the oneillustrated in FIG. 17, illustrating forming doped drain/source regionsand source/drain regions in the active silicon region;

FIG. 19 is a next step in the series depicting a cross-sectional view ofthe construction of a quantum point contact device such as the oneillustrated in FIG. 18, illustrating metal silicide depositions;

FIG. 20 is a next step in the series depicting a cross-sectional view ofthe construction of a the quantum point contact device such as the oneillustrated in FIG. 10, illustrating pre-metal dielectric and contacttungsten formation;

FIG. 21 depict in a cross-sectional view a quantum point contact deviceand a MOS transistor fabricated together on a single integrated circuit;

FIG. 22 depicts in a projection a quantum point contact device and a MOStransistor fabricated together on a substrate; and

FIG. 23 depicts in a simplified circuit schematic a circuit applicationincorporating a resistor quantum point contact.

Corresponding numerals and symbols in the different figures generallyrefer to corresponding parts unless otherwise indicated. The figures aredrawn to clearly illustrate the relevant aspects of the illustrativeexample arrangements and are not necessarily drawn to scale.

DETAILED DESCRIPTION

The making and using of various example illustrative arrangements thatincorporate aspects of the present application are discussed in detailbelow. It should be appreciated, however, that the illustrative examplesdisclosed provide many applicable inventive concepts that can beembodied in a wide variety of specific contexts. The specific examplesand arrangements discussed are merely illustrative of specific ways tomake and use the various arrangements, and the examples described do notlimit the scope of the specification, nor do they limit the scope of theappended claims.

For example, when the term “coupled” is used herein to describe therelationships between elements, the term as used in the specificationand the appended claims is to be interpreted broadly, and while the term“coupled” includes “connected”, the term “coupled” is not to be limitedto “connected” or “directly connected” but instead the term “coupled”may include connections made with intervening elements, and additionalelements and various connections may be used between any elements thatare described as “coupled.”

FIG. 1 is a top view of a quantum point contact 100. In FIG. 1 an activearea 112 is shown. Active area 112 is an area of a semiconductorsubstrate that can receive impurities to form doped regions. Overlyingthe active area 112 is a gate 114. The semiconductor substrate can besilicon, for example, which is typically used in manufacturingintegrated circuits including MOS transistors, for example.Alternatively, gallium arsenide (GaAs) and other semiconductor substratematerials can be used. In addition, epitaxial layers over insulators(SOI) can be used instead of the semiconductor substrate. The gate 114can be formed of a polysilicon, a doped polysilicon, or other conductivematerials. The gate 114 can be replaced at a later process step with ametal gate, for example.

In FIG. 1, a notched area of the gate 114 with a width labeled W_(QPC)can be seen which forms the quantum point contact device 100. The widthof the notched area W_(QPC) can be in a range that can be achieved usingcurrent fine lithography techniques that can be between 5 and 20nanometers. In an example arrangement the width W_(QPC) is less than orequal to about 15 nanometers. The width of the quantum point contactforms a quantum device in a channel region underlying the gate 14. Aquantum point contact has a “particle in a box” confinement that occursin the channel region in the transistor width direction. The quantumpoint contact sub-bands “turn on” individually, giving rise to quantizedjumps in conductivity (from drain to source) G_(ds) with the quantizedjumps as a function of the voltage at the gate, V_(GS). For roomtemperature quantization, the transistor width direction is the same asthe length confinement needed for the quantized well behavior describedin the U.S. Patent Application Publication No. 2012/00098590, titled“Quantum Electro-Optical Device using CMOS Transistor with ReversePolarity Drain Implant,” referenced above and incorporated herein, e.g.in a range from about 5 to 15 nanometers. The quantum point contactdevice is not operated as a three-dimensional confinement in aquantization well, instead, it has quantized conductance channels, whichis why the quantum point contact device provides a quantum resistance.

The quantum point contact forms a path between doped diffusion sourceand drain regions that has a conductance that is proportional only tophysical constants, as described above. The conductance value can bemoderated in quantized or step levels proportional to the potential onthe gate conductor. In sharp contrast to the prior known solutions, theconductance for this device is not dependent on either temperature or onprocess variation factors. Thus an accurate conductance (or inversely,resistance) that is necessarily accurate over temperature and processvariations, and which is obtained without the need for complexcompensation circuitry, can be attained.

FIG. 2 illustrates a schematic view of an example quantum point contactdevice 200. The device 200 resembles a MOS transistor and in examplearrangements, can be formed in a fabrication process similar to a MOStransistor. Alternatively the device can be formed in a dedicatedprocess for semiconductor fabrication. The device 200 has a sourcediffused region spaced from a drain diffused region by a constrictedchannel area underlying a gate as shown in the arrangement of FIG. 1. Aquantum point contact is formed in the channel, and as the potential onthe gate terminal G varies, the level of the quantized conductanceG_(ds) between the drain and source terminals will also vary, but theconductance will vary between quantized levels that are proportionalonly to the physical constants e and h, as described above.

FIG. 3 illustrates in a top view a gate conductor overlying diffusedregions of an arrangement for a quantum point contact device 300 that issimilar to the arrangement of FIG. 1. In FIG. 3, an active area 310includes doped regions forming source and drain areas, lightly dopeddrain regions 330, and a channel region 340, the channel regionincluding a narrow quantum point contact 311 having a width in thetransistor width direction that is again in the range of 5 to 20nanometers and in an example arrangement can be less than or equal toabout 15 nanometers. A gate conductor 320 is shown overlying the channelregion and having a narrowed or notched portion of a similar shape asthe channel region. The narrowed region forms a quantum device with aconstricted path for electrons and holes to travel, forming the quantumpoint contact device 300. While not visible in FIG. 3, additionalimplants such as VT adjust implants can be used in the channel region tocreate a lateral confining potential well.

FIG. 4 depicts the quantized conduction levels in the cross section 4-4′of FIG. 3, illustrating the quantized levels that are experienced byelectrons in the constricted area of the quantum point contactarrangement of FIG. 3. The cross section is taken along the transistorwidth direction of the quantum point device. A conduction path is formedin the narrowed channel region between a drain diffusion and a sourcediffusion on either side of the channel region. The levels are quantizedat levels proportional to the quantity 1/13 kohms as described above.The conductance levels can be varied in quantized steps using by varyingthe potential on the gate conductor of the device. In this manner aresistance that has a value independent of temperature and processvariation dependencies and proportional to a constant is achieved. Byplacing a predetermined potential on the gate terminal, the resistancewill be a known value independent of temperature and process variations,in sharp contrast to the resistance components of the known priorapproaches.

FIG. 5 illustrates a potential diagram showing the saddle shapedconduction potential of the quantum point contact arrangements such asin FIG. 4 in the transistor width or “W” direction of the device and inthe transistor length or “L” direction of the device. The quantum pointcontact device is not a confinement quantum well, but instead, theconduction band is a saddle shaped path with quantized levels, asdescribed above.

FIG. 6 depicts in a top view an alternative example arrangement forforming a quantum point contact device 600 having a quantum pointcontact 601. In FIG. 6 quantum point contact device 600 is formed usingan example arrangement that is particularly designed to be highlymanufacturable in a MOS process using conventional photolithography. Inthis arrangement, a constricted channel area for a quantum point contact601 can be formed which is an overlap between two polygons, so that noextremely narrow polysilicon areas need to be formed. Usingphotolithography, patterning and etch to form very small dimensiongeometries in a semiconductor process can result in lower yields if theprocess varies, which can cause an open to form, or that can result inan unwanted thinning of the small features. Alignment variations canalso cause an error in the formation of the small dimension geometriesthat could expand the dimension and thus, cause the dimension to be toolarge for the confinement needed for the quantum device. To increase themanufacturability of the regions needed to form the quantum device 600,an arrangement formed using overlapping rectangles or squares is shownin FIG. 6.

In FIG. 6, an active area 620 formed in a semiconductor substrate isshown. Source and drain contact areas 631 are formed to form theterminals of the quantum point contact device. Source region 630 anddrain region 640 are doped diffusion areas. A gate structure formed ofdoped or undoped polysilicon regions 622, 624 is formed over a gatedielectric (not visible in this top view) lying over a channel regionbetween doped drain and source diffusion regions. The gate structureincludes two polygon shapes 622, 624 which can be squares, orrectangles, with an overlap in a corner portion of each of the twopolygon shapes, the constricted part of the quantum point contact device600 is formed in this overlapping region 601. The arrangement of FIG. 6provides a quantum point contact device 600 that is arranged to avoidknown issues with photolithographic processes, the constricted quantumpoint contact 601 of the gate is provided without notches, chamfers orsteps that could close or form opens due to the extremely smalldimensions needed. In FIG. 6, the length of the area 601 where thequantum point contact is formed, labeled L_(QPC), and the width wherethe quantum point contact is formed, labeled W_(QPC), are arranged tomeet the criteria shown in Equation 1:MAX[L_(QPC),W_(QPC)]<35 nanometers; both L_(QPC),W_(QPC)>0.  Equation 1

Additional criteria are:

-   -   No polysilicon geometry with dimension less than a minimum, for        example, 35 nanometers    -   No polysilicon notches    -   No polysilicon stepping or chamfers

By forming the quantum point contact device 600 using a layoutarrangement in a manner that satisfies the criteria of Equation 1, thequantum point contact device 600 has increased manufacturability in aconventional MOS semiconductor process using existing photolithography,pattern and etch processes and tools. By forming the device 600 whileavoiding the need for geometries and shapes that tend to increase yieldproblems when using conventional photolithographic tools and processsteps in a semiconductor process, the example arrangement of FIG. 6provides a quantum point contact device that can be manufactured atrelatively low costs.

In order to further illustrate the features of the quantum point contactdevice 600 presented in FIG. 6, two different cross sections aredepicted in FIGS. 7 and 8. In FIG. 7 a simplified cross section of thesection of the quantum point contact device 600 labeled 7-7′ in FIG. 6is shown. The cross section 700 depicts a portion of the semiconductorsubstrate 702, a drain/source region 730, a source/drain region 740, agate dielectric layer 780, and a gate conductor 760. The drain/sourceregion 730 and the source/drain region 740 can each be formed of a dopeddiffusion region such as a lightly doped drain (LDD) region that is afirst conductivity type. For example the drain/source region 730 and thesource/drain region 740 can be N type regions to form an “NMOS” typedevice that has doped diffused portions similar to those for an NMOStransistor. In this case, the substrate portion 702, which can be an ionimplanted well region in a substrate or in an alternative arrangement,which can be an epitaxial layer, can be doped to a second conductivitytype such as a P-type well. In a semiconductor substrate multiple wellareas can be formed of both P and N types, using implanted impurities todope the substrate, the wells can be electrically isolated using shallowtrench isolation (STI), or using LOCOS isolation for example. The gatedielectric 780 can be formed of any of a plurality of gate dielectricmaterials, such as silicon dioxide, hafnium oxide or other insulatingmaterials and having a thickness between about 1 nm and about 30 nm isformed on the top of the semiconductor portion 702 by known methods. Agate conductor 760 is formed over the gate dielectric layer and can beformed of polysilicon, doped polysilicon and in other arrangements, canbe replaced with a metal gate material.

The cross section of the quantum point contact 700 illustrates thesimilarity of portions of the quantum point contact device to aconventional MOS transistor. The structure of the quantum point contactdevice 600 in FIG. 6 can be produced in a conventional MOS transistorfabrication process. In another arrangement, the quantum point contactdevice (or a plurality of quantum point contact devices) can be formedsimultaneously with the formation of MOS transistors in the sameintegrated circuit. If the process includes both NMOS and PMOStransistors, the semiconductor process is said to be a CMOS process. Inthis manner, an arrangement including the quantum point contact deviceon an integrated circuit can be formed with accompanying transistors andcircuits, to form an integrated circuit having accurate resistors andtransistors in the same circuitry.

FIG. 8 depicts in another cross sectional view the portion of thearrangement quantum point device 600 of FIG. 6 taken along section 8-8′in FIG. 6. In FIG. 8, cross section 800 includes a substrate 802, asource/drain region 830, a drain/source region 840, a gate conductor 860and a gate dielectric 880. The cross section of FIG. 8 illustrates theportion of the quantum point contact device that is in the conductionpath, e.g., the diagonal path D_(QPC) taken at the narrow constrictionof the quantum device between the source and drain regions. In anarrangement the distance D_(QPC) in FIG. 8, the width of theconstriction of the quantum point contact is less than about 20nanometers, and in an illustrative example arrangement, is between 5-15nanometers. In another example the distance D_(QPC) is approximatelyequal to 15 nanometers.

FIG. 9 illustrates in a top view 900 an additional alternativearrangement. In FIG. 9, a drain/source region 920 is formed byimplanting impurities in a substrate 902. A source/drain region 921 islikewise formed by implanting impurities in substrate 902. In an exampleillustrative arrangement, the drain/source region and the source/drainregion can be doped to a first conductivity type, such as an N-type,while the substrate 902 is doped to a second conductivity type, such asP-type, to form for example a P-well. A lightly doped drain region 940is formed. As in forming MOS transistors, the lightly doped drain regionis also formed by implanting impurities. To form LDD region 940 adjacentthe drain/source region 920 and the source/drain region 921, a diffusionprocess is used to extend the LDD region beneath a portion of the gatestructure formed by the two gate portions 922, and 924. As describedabove the gate regions intersect at a corner portion of the two polygonsthat form the gate portions 922, 924, and the intersection meets thecriteria of Equation 1 to form the quantum point contact device. In FIG.9, pocket implants 960 are shown. These pocket implants (sometimesreferred to as “halo” implants) are formed using a 2-rotation tilt orangled implant approach. U.S. Pat. No. 7,994,009, titled “Low CostTransistors using Gate Orientation and Optimized Implants”, listinginventors Benaissa et al., which is co-owned with the presentapplication and which is hereby incorporated herein by reference in itsentirety, describes appropriate example ion implantation steps. In thisapproach, the pocket implants are only made in the vertical direction inFIG. 9, and not in the horizontal direction, because the tilt or angledpocket implants are not made in all 4 possible rotation directions, butare only made in 2 rotation directions. The pocket implants form theconstricted area in FIG. 9 labeled width W_(QPC) and an opening in thepocket implants is controlling the width. The pocket implants can beformed using tilt or angled implants of a second conductivity type, forexample, of P-type dopants, to further control the channel portion. Inaddition, substrate 902 can also have threshold voltage or Vt adjustimplants performed in the channel region beneath the gate structure.These pocket implants can also be performed in conjunction with orcontemporaneously with pocket implants used to form NMOS or PMOStransistors elsewhere on the substrate.

The arrangement of FIG. 9 forms an “enhancement mode” device. In thisarrangement, as the potential on the gate conductor 922 increases, theconductance will vary and will vary in quantized levels proportional tothe physical quantity ratio 2e²/h, where e is the electron charge, and his Planck's constant, inversely this forms a resistance proportional toapproximately 1/13 kohms that depends only on physical constants, as isdescribed above. The width W_(QPC) provides the confinement for thequantum effect and is between 5-20 nanometers in an example arrangement,and in another particular example, is 15 nanometers. The thresholdvoltage needed for conduction will be similar to the threshold for a“natural NMOS” device, a low Vt device, and will be between 0.2-0.4Volts for typical CMOS processes. This threshold voltage is processdependent; however the conductance will vary in quantized levels as afunction of the threshold voltage, so that a known conductanceproportional only to physical constants can be accurately obtained forthe device.

FIG. 10 depicts in a cross sectional view 1000 a portion of thearrangement of FIG. 9 taken along the section labeled 10-10′. In FIG.10, a portion of a semiconductor substrate 1002 is shown. The portion ofthe substrate 1002 can be, for example, a doped region to form a P-wellor in an alternative arrangement region 1002 can be doped to form anN-well. An epitaxial layer can also be used. In FIG. 10, regions 1020and 1021 are doped diffusion regions that form a drain/source and asource/drain for the device 1000. Lightly doped drain (LDD) regions suchas 1040 can be formed to extend the doped regions beneath the outerportions of the gate 1022. Pocket implants can be performed using, forexample, tilted or angled ion implantation and form pocket regions 1060.

In the example arrangement of FIG. 10, the quantum point contact deviceshown in the cross section 1000 is formed in a manner similar to an NMOStransistor, so that the drain/source and source/drain regions are dopedto an N-type conductivity, the LDD regions 1040 are also doped to anN-type conductivity, and the substrate 1002, and the pocket implantregions 1060, are each doped to a P-type conductivity. In this mannerthe device has doped regions that correspond to the doped regions usedto form an NMOS transistor. In an alternative arrangement that will beclear to the reader of skill in the relevant art, a quantum pointcontact device can be formed that uses doped diffusion regions thatcorrespond to a PMOS transistor, with P-type drain/source andsource/drain regions in an N-type substrate or N-type well.

In FIG. 10, a gate structure 1022 overlies the substrate 1002 and formsa channel portion between the drain/source region 1020 and thesource/drain region 1021. The gate dielectric layer 1025 lies beneaththe gate structure 1022, and the gate also has insulating sidewallportions 1023 formed of an oxide or oxynitride. In operation thearrangement of FIGS. 9 and 10 is similar to an “enhancement mode” NMOSdevice. As the potential on the gate is increased, the conductanceG_(DS) will vary in a stepwise manner corresponding to the quantizedconductance levels.

FIG. 11 illustrates a top view of doped diffusion regions for analternative arrangement of a quantum point contact device 1100. In FIG.11, doped diffusion regions 1120 and 1121 form a drain/source andsource/drain diffusion region respectively. LDD regions 1140 are formedextending the drain/source and source/drain regions beneath the outeredges of the gate structure which is formed from two gate portions 1122and 1124. As described above, the two gate portions overlap in a cornerregion forming a constricted area for the quantum device. In thearrangement of FIG. 11, pocket implants such as 1160 are formed beneaththe LDD diffused regions by a tilted or angled ion implant. As describedabove, the pocket implants of the arrangements are formed using only 2rotation implants, so that no pocket implant is formed in the horizontaldirection, instead the pocket implants are formed only in the verticaldirection. The polysilicon is also oriented in the vertical directionand is not oriented in the horizontal direction. In addition the channelcan receive VT adjust doping implantation to further tailor the lateralconfinement well.

In the arrangement of FIG. 11, the diffused regions and the pocketimplants are altered using implant dopants to form a device theresembles a “depletion mode” device. The current path labeled “QPC Path”flows through the constricted area to provide the quantum point contact1101. The width W_(QPC) in FIG. 11 is a small distance that is less thanabout 20 nanometers. In one example arrangement the width W_(QPC) inFIG. 11 is less than or equal to about 15 nanometers. In anothernon-limiting example arrangement, the W_(QPC) in FIG. 11 is between 5and 20 nanometers.

FIG. 12 depicts in a cross sectional view 1200 the section portion ofthe quantum point contact device 1100 of FIG. 11 labeled 12-12′. In FIG.12, the cross sectional view depicts the substrate 1202, which can be aP-type substrate or can be doped to form a P-well for example by usingP-type dopants, a drain/source region 1220, a source/drain region 1221,pocket implants 1260 and the LDD regions 1240. The gate structure 1222corresponds to the gate structure 1122 in FIG. 11. In the arrangementdepicted in FIG. 12, the LDD diffusions and the pocket implants are“reversed” from the arrangements of FIGS. 9 and 10. In FIG. 12, thedrain/source and source/drain regions can be doped to an N-typeconductivity, for example. The LDD regions 1240 in this examplearrangement are doped to a P-type conductivity. The pocket implants 1260are doped to N-type conductivity. The resulting quantum point contactdevice operates in a mode similar to a “depletion” mode NMOS device, inthat as the voltage on the gate 1222 is reduced farther below athreshold, the device conducts and the conductance is again quantized,that is, the conductance will transition through a series of quantizedsteps, varying with the now negative potential on the gate 1222.

FIGS. 13-20 depict cross sectional views in a series of steps an examplemethod for fabricating the quantum point contact devices described abovein a CMOS semiconductor process. While FIGS. 13-20 illustrate an exampleseries of steps for forming the quantum point contact devices, oneskilled in the art will recognize that in some cases, the order of stepscan be changed, and known alternative steps can be used, to formadditional arrangements that form additional aspects of the presentapplication. For example, the pocket implants described above can beomitted in some arrangements to form additional alternativearrangements. Additional VT adjust and channel implants can be used tofurther tailor the constriction area in the channel and thesealternatives form further arrangements and aspects of the presentapplication.

FIG. 13 depicts in a first cross sectional view 1300 the step of forminga well region by ion implantation and the well electrically isolatedfrom additional well regions in a substrate 1302. The semiconductorsubstrate 1302 that will include the quantum point contact device (and,in some arrangements that form aspects of the present application, whichcan also host other MOS transistor devices) can typically be a P-typesingle crystal silicon substrate. It is also within the scope of thepresent application to use any substrate that supports fabrication of anintegrated circuit in a CMOS process including, but not limited tosilicon-on-insulator (SOI) or a hybrid orientation technology (HOT)substrate, or on any epitaxial layer compatible with CMOS semiconductorfabrication. Furthermore, it is contemplated that the same quantum pointcontact structures can be formed in III-V semiconductor compounds suchas, but not limited to, gallium nitride (GaN), indium phosphide (InP)and indium arsenide (InAs). These semiconductor compounds can be fullsubstrates or can simply be epitaxial layers on other host substrates.

In FIG. 13, electrically isolated regions or wells in a semiconductorsubstrate 1302 are created using, in one example arrangement, a shallowtrench isolation (STI) process in which trenches or moats 1304, commonly200 to 500 nanometers (nm) deep that are etched into the substrate 1302.The trenches 1304 can be filled with a dielectric material using thermaloxidation and HDP, PECVD or other dielectric deposition methods.Alternative isolation approaches between the wells include forming LOCOS(localized oxidation of silicon) regions. Subsequently, a photoresistfor patterning, in this particular non-limiting example, P-wells, isselectively applied on the wafer surface leaving exposed regions to beimplanted with P-type impurities 1314 such as, for a non-limitingexample, boron atoms in concentrations from 1-10¹¹ to 1-10¹⁴ atoms/cm².The ion implant forms P-wells 1310 which extend from a top surface ofthe substrate 1302 to a depth typically 50 to 500 nm below the bottom ofthe STI regions 1314. The adjoining wells (partially visible in FIG. 13on either side of P-well 1310) can be doped to P-type or N-typeconductivity, depending on the dopant applied for the desired transistortype. Once the ion implantation forming P-wells 1310 is completed, thephotoresist 1312 can be removed using known photoresist strip and cleanprocesses leaving the P-well 1310 electrically isolated by the STIregions 1304.

FIG. 14 depicts, in another cross sectional view, a device 1400 whichcorresponds to the device 1300 in FIG. 13 following additional steps. InFIG. 14, device 1400 includes a gate dielectric layer 1460, typically ofsilicon dioxide, hafnium oxide or other insulating materials and havinga thickness between about lnm and about 30 nm is formed on the top ofthe substrate 1402 by known methods in a central portion of the wellregion 1410. In one arrangement that forms an aspect of the presentapplication, NMOS gate and PMOS gate dielectric layers or gateinsulators (not shown in FIG. 14) in other portions of the substrate 02can be fabricated with similar materials and similar thicknesses, andcan be formed concurrently in time with the gate dielectric 1460.Alternatively the PMOS and NMOS gate dielectrics can be formedindependently of the gate dielectric 1460 and of different materialsand/or thicknesses.

Still referring to FIG. 14, a gate 1470 is formed on top of the gatedielectric 1460. The gate 1470 is typically formed from polycrystallinesilicon, referred to as polysilicon. The polysilicon is deposited overthe gate dielectric layer 1460 and can also be deposited over NMOS andPMOS gate dielectric layers (not shown) to form NMOS and PMOS gatestructures elsewhere on the substrate 1402. A gate photoresist pattern,not illustrated here for simplicity, is then applied over the gatematerial and patterned for an etch process. Any unwanted gatepolysilicon and the unwanted portions of the underlying gate dielectric1460 are removed by known etching methods. The gate photoresist is thenalso removed. The gate structures for any NMOS and/or PMOS transistorsthat are disposed in wells other than wells 1410 can be simultaneouslypatterned while the gate polysilicon 1470 is formed. In somearrangements that form additional aspects of the present application, areplacement gate such as a metal gate can be used to replace thepolysilicon gate 1470 at a later processing step. As shown in FIG. 14,gate spacers 1469 are then formed of an insulator such as an oxide,oxynitride, or nitride layer. The gate spacers 1469 can be formed byoxide growth on the polysilicon 1470 or by other known means. The gatespacers can be patterned by an anisotropic etch step. As for other stepsdescribed herein, gate structures for NMOS and/or PMOS devices beingcontemporaneously fabricated on substrate 1402, not visible in FIG. 14,can be formed simultaneously.

FIG. 15 depicts a next step in a cross-sectional view of theconstruction of a quantum point contact device 1500 illustrating anotherphotoresist 1512 and a series of ion implantation steps. In FIG. 15photoresist 1512 is applied to the surface of the substrate 1502 andpatterned leaving openings for implanting P-type impurities 1514 to formoptional pocket regions 1532, and then using the same photoresist 1512,implanting N-type impurities 1516 to form N-type lightly doped drain(NLDD) regions 1534. The gate spacer 1569 is used to space the ionimplant dopants from the channel region under the gate 1570. Note thatwhile the implants shown for the device 1500 are being performed,additional implants of P-type pocket implants, and other N-type LDDregions, can be formed simultaneously in other NMOS and PMOS transistorregions (not visible in FIG. 15). P-type dopants 1514 are firstimplanted, in one arrangement, to form P-type pocket regions 1532. Theimpurities 1514 in the P-type implant can be boron, gallium or indium,for example, in concentration ranges from about 1×10¹¹ to about 1×10¹⁴atoms/cm². The implant of the dopants 1514 can be performed at an angleor tilt to reach the substrate beneath the gate spacers 1569 as shown.As described above, the pocket implants are formed using a 2 rotationtilt implant approach, and so the pocket material only forms in thevertical direction in FIGS. 9 and 11, for example. The N-typeimplantation 1516 then is performed to form the lightly doped drainregion 1534 (labeled NLDD). The impurities used in the N-type implant1516 can be phosphorus and arsenic in concentration ranges from about1×10¹³ to about 5×10¹⁴ atoms/cm², for example. After the implantingstep, the photoresist 1512 can be removed with known processes.

FIG. 16 illustrates in another cross-sectional view 1600 depicting dopedregions of the quantum point contact device after an anneal step tocomplete the doped regions. The doped regions are the P-well 1610, theoptional P-type pocket regions 1632, and the NLDD region 1634. In thearrangement of FIG. 11, the pocket regions 1632 are optional and inanother alternative process that is contemplated as forming anadditional arrangement of the present application, they can be excluded.In the arrangement of FIG. 9, however, the pocket implants are needed.At this stage in the processing of the device 1600, portions of theimplanted doped regions 1632, 1634 and 1610 can be activated byperforming a thermal anneal. Anneals can be performed using knownmethods such as rapid thermal processing (RTP) or laser annealing or byuse of an oven. In an alternative approach, thermal processing can beperformed between some of the steps described above.

FIG. 17 depicts a next step in the process in a cross-sectional view ofthe construction of a quantum point contact 1700 illustrating creationof gate spacers. The gate spacers 1790 are formed on the lateralsurfaces of the gate 1770 and over the sidewall spacers. The gatespacers 1790 are typically formed from a layer of silicon dioxidebetween 1 and 10 nm thick. Other dielectric materials can also be used.The gate spacers 1790 can commonly be formed by oxidation of thepolysilicon of the gate 1770 or by conformal deposits silicon dioxideand/or silicon nitride. The gate spacers 1790 can have a differentthickness than NMOS or PMOS gate spacers also formed on the substrate1702, or can be the same thickness. After formation the gate spacers1790 are patterned and/or etched to remove any unwanted depositedmaterial.

FIG. 18 depicts in another cross-sectional view a next step of theconstruction of a quantum point contact 1800 illustrating an N-typesource-drain implant in drain/source and source/drain regions 1862. InFIG. 18 a photoresist 1812 is applied to the surface of the substrate1802 and patterned leaving openings for implanting ions into to formregions 1862 for the quantum point contact. The impurities in N-typeimplant 1814 can be phosphorus and arsenic, for example, inconcentration ranges from about 1×10¹⁴ to about 5×10¹⁶ atoms/cm². Afterthe ion implantation, the photoresist 1812 is removed with knownprocesses. Note that the ion implantation 1814 can be used to formN-type source drain regions elsewhere on the substrate, for NMOStransistors, for example for devices that are not visible in FIG. 18.

FIG. 19 depicts a next step in a cross-sectional view of theconstruction of a quantum point contact device 1900 illustrating a metalcontact deposition. In one arrangement, the polysilicon in the gate1970, and the two NSD doped regions 1962 are partially replaced by metalor metal silicide by known processes. For one non-limiting example,nickel may be deposited on the top surfaces of the gate 1970, NSDregions 1962 followed by heating of the substrate 1902 to react thenickel with the underlying polysilicon to form metal silicide. A wetetch, or other known process, can be employed to selectively remove theunreacted nickel leaving the metal silicide layer forming a drainsilicide 1950, the gate contact 1952 and on the source silicide 1954.Other metals can be used. Silicide contacts can simultaneously beperformed in other portions of the substrate 1902 and form silicidecontacts for NMOS or PMOS transistors elsewhere in the substrate. Thegate spacers 1990, the lightly doped drain regions 1934, the pocketregions 1932, and the P-well 1910 are arranged as described above.

FIG. 20 depicts in another cross-sectional view 2000 the construction ofa quantum point contact illustrating forming pre-metal dielectric (PMD)2095 and tungsten conductors. Referring to FIG. 20, a PMD layer 2095,typically consisting of thin layer of silicon nitride or silicondioxide, deposited 10 to 100 nanometers thick, is followed by formationof a 100 to 1000 nanometer layer of silicon dioxide or phosphor-silicateglass (PSG). In one example process, the PMD layers can be depositedusing PECVD and then can be planarized by a chemical-mechanical polish(CMP) process. An optional PMD top layer, commonly 10 to 100 nanometersthick of a hard material such as silicon nitride or silicon carbide canbe formed on the top surface of the substrate 2002. Alternative knownprocesses for forming PMD layers can be performed. Drain contact 2031,gate contact 2033 and source contact 2035 which make physical andelectrical contact with the metal silicide contacts below them areformed in the PMD layer 2095 by known methods, including using aphotoresist pattern on the top layer of the PMD to expose the contactarea, etching contact holes thru the PMD down to the metal silicide onthe substrate 2002 and filling the contact holes with a contact linerand subsequently forming contact fill metal, typically tungsten. Theprocesses described here are non-limiting examples and other alternativeprocesses for forming the contacts can be performed and thesealternatives form additional arrangements of the present application.

At the stage shown in the cross-sectional view 2000 of FIG. 20 thequantum point contact device is complete. The arrangement described inFIGS. 13-20 corresponds to the “enhancement” device illustrated in FIGS.9 and 10. The ion implant steps can also be modified to form the“depletion” mode device illustrated in FIGS. 11 and 12 by modifying theion implant atoms to change the conductivity types. One skilled in theart will realize that by implanting P-type LDD regions, and N-typepocket regions, instead of the N-type LDD and P-type pocket regionsshown in the series of steps illustrated in FIGS. 13-20 above, thealternative arrangement quantum point contact device can be formed.

FIG. 21 illustrates in a cross-sectional view an arrangement 2100including an NMOS transistor 2103 and a quantum point contact device2104 constructed adjacent to each other in a well region 2110 oversubstrate 2102. The devices in FIG. 21 can be built concurrently withinthe same MOS fabrication process. The substrate 2102 contains a P-wellregion 2110 which spans a pair of regions electrically isolated by STI2104 a, 2104 b, 2104 c. Within the P-well 2110, between the center andleft two isolation trenches 2104 a and 2104 b are NSD regions 2162 a and2162 b, N-type regions 2134 a and 2134 b, P-type region 2132 a and 2132b. Above the substrate 2102 in the NMOS region 2103 is the sourcecontact 2181, gate contact 2183 and drain contact 2185 of an NMOStransistor. In the quantum point contact device region 2104, is thedrain contact 2131, the gate contact 2133 and the source contact 2135for the quantum point contact device.

Illustrating the ability to create the quantum point contact device 2104concurrently within a CMOS process along with the creation of an NMOStransistor, the P-well 2110 for the NMOS transistor 2102 and quantumpoint contact device 2104 is formed in the same process step. The P-typeregions 2132 b and 2132 are formed concurrently. Each of the structuretypes above the substrate 2102 can be formed concurrently for the NMOS,for PMOS transistors if included and for quantum point contact devices.It can be seen that by changing the conductivity types in portions ofthe pocket implants, and for the lightly doped drain and source/drainregions, a process for forming CMOS transistors can be used to form thenovel quantum point contact device using existing implant materials andprocesses, so that the quantum point contact device is compatible withcurrent semiconductor processes and tools, making fabrication of thequantum point contact devices cost effective and efficient.

FIG. 22 depicts in a projection view 2200 a quantum point contact device2204 fabricated in a P-well 2210 in a semiconductor substrate 2202 withan NMOS transistor 2203 formed simultaneously. For clarity ofillustration, isolation structures are omitted in FIG. 22 but can beformed between the devices. IN FIG. 22, the NMOS transistor 2203includes a gate 2283 overlying a channel region between a drain/sourceregion 2262 b and a source/drain region 2262 a. Each of the drain/sourceand source/drain regions is formed of N-type source/drain implants. FIG.22 also depicts quantum point contact device 2204 which includes a gate2233, a source 2235, and a drain/source region 2162 b, which in thisexample arrangement is common with the drain/source region of the NMOStransistor 2203, a source/drain region 2262, and a channel lying beneaththe gate 2233 and between the LDD regions 2234.

The gate 2233 in FIG. 22 for the quantum point contact device is shownwith a wide portion that is then narrowed to form a constriction areahaving a width D_(QPC). This constriction area provides the quantumconfinement needed to form the quantum point contact and can range inwidth from 5 to about 20 nanometers. In an example arrangement thedistance D_(QPC) is about 15 nanometers.

In operation, the quantum point contact device of FIG. 21 or 22 willform a resistance with levels of quantized conductance corresponding tothe potential on the gate terminal, and each level is proportional tothe gate potential on gate 2233 for example.

FIG. 23 depicts, in a simplified circuit schematic, an illustrativearrangement for a current source circuit 2300 incorporating a quantumpoint contact resistance R_(QPC). In FIG. 23, a current source circuitis provided. A reference voltage Vref is divided across resistors R1 andR2 to provide a voltage V1 that, by reason of the voltage divider, willbe equal to Vref*(R1/R1+R2). The op-amp 2301 is configured to comparethe two voltages at the terminals and will adjust the voltage at thegate of transistor M0 to make them equal, producing a current IR throughthe quantum point contact resistance R_(QPC). The value of thisresistance will be proportional to the constants and as described abovewill be proportional to the quantity 1/13 kohm with the level set by thegate potential on the quantum device. The current IR will then be simplyV1/R_(QPC) The current IR is then output by current mirror devicestransistors M1, M2 as currents I1, I2. If the transistors are matched,then IR=I1=I2. If the transistor sizes are ratioed, then I1, I2 can beproportionally related to IR. In sharp contrast to the current sourcesof the prior known approaches, use of the resistance R_(QPC), whichincorporates the quantum point contact device, produces currents I1, I2that are independent of temperature and which will also be independentof process variations. Use of the novel arrangements of the presentapplication in this example circuit therefore reduces the amount ofcircuitry needed to provide current sources for the remainder of thecircuitry, and provides an accurate current that is fixed in value. Theresistance R_(QPC) can be used in a wide variety of applicationcircuits, and the current source circuit of FIG. 23 is but one exampleof such a circuit arrangement that is provided to illustrate the use ofthe quantum point contact resistance.

Various modifications can also be made in the order of steps and in thenumber of steps to form additional novel arrangements that incorporateaspects of the present application, and these modifications will formadditional alternative arrangements that are contemplated by theinventors as part of the present application and which fall within thescope of the appended claims.

Although the example illustrative arrangements have been described indetail, it should be understood that various changes, substitutions andalterations can be made herein without departing from the spirit andscope of the present application as defined by the appended claims.

Moreover, the scope of the present application is not intended to belimited to the particular illustrative example arrangement of theprocess, machine, manufacture, and composition of matter means, methodsand steps described in this specification. As one of ordinary skill inthe art will readily appreciate from the disclosure, processes,machines, manufacture, compositions of matter, means, methods or steps,presently existing or later to be developed, that perform substantiallythe same function or achieve substantially the same result as thecorresponding example arrangements described herein may be utilizedaccording to the illustrative arrangements presented and alternativearrangements described, suggested or disclosed. Accordingly, theappended claims are intended to include within their scope suchprocesses, machines, manufacture, compositions of matter, means,methods, or steps.

What is claimed is:
 1. A quantum point contact device, comprising: asemiconductor substrate having a top surface; a channel regionpositioned near the top surface of the semiconductor substrate and dopedto a first conductivity type; a gate structure positioned above thechannel region, the gate structure having a first polygonal shape and asecond polygonal shape, the first and second polygonal shapesoverlapping each other at a corner thereof to define a quantum pointcontact with the channel region; a first doped region positionedadjacent to the channel region and doped to a second conductivity typeopposite the first conductivity type, the first doped region alignedwith a first side of the gate structure and having a first corner facingthe quantum point contact; and a second doped region separated from thefirst doped region by the channel region and doped to the secondconductivity type, the second doped region aligned with a second side ofthe gate structure and having a second corner facing the quantum pointcontact, the first and second corners defining a path across the quantumpoint contact and diagonally crossing the channel region.
 2. The quantumpoint contact device of claim 1, wherein: the first polygonal shapeincludes a first rectangular shape having a first gate corner; and thesecond polygonal shape includes a second rectangular shape having asecond gate corner overlapping the first gate corner at the corner todefine the quantum point contact with the channel region.
 3. The quantumpoint contact device of claim 1, wherein the first conductivity type isP-type and the second conductivity type is N-type.
 4. The quantum pointcontact device of claim 1, wherein the first conductivity type is N-typeand the second conductivity type is P-type.
 5. The quantum point contactdevice of claim 1, further comprising: first implants aligned with thefirst side of the gate structure along a width direction of the channelregion; and second implants aligned with the second side of the gatestructure along the width direction of the channel region.
 6. Thequantum point contact device of claim 5, wherein: the first and secondimplants are each doped to the first conductivity type; and one of thefirst implants is spaced apart from one of the second implants to definea width of the quantum point contact.
 7. The quantum point contactdevice of claim 5, wherein: the first and second implants are each dopedto the second conductivity type; and one of the first implants connectswith one of the second implants to define a width of the quantum pointcontact.
 8. The quantum point contact device of claim 1, furthercomprising: a first lightly doped region extending from the first dopedregion to the channel region, the first lightly doped region having afirst doping concentration lower than the first doped region; and asecond lightly doped region extending from the second doped region tothe channel region, the second lightly doped region having a seconddoping concentration lower than the first doped region.
 9. The quantumpoint contact device of claim 8, wherein the first and second lightlydoped regions are each partially under the gate structure.
 10. Thequantum point contact device of claim 1, wherein the quantum pointcontact defines a current path having a width between 5 and 20nanometers.
 11. The quantum point contact device of claim 1, wherein thequantum point defines a current path having a width of 15 nanometers.12. The quantum point contact device of claim 1, wherein the quantumpoint contact defines a current path having a width less than 35nanometers.
 13. An integrated circuit, comprising: a semiconductorsubstrate having a top surface; a quantum point contact device having: achannel region positioned near the top surface of the semiconductorsubstrate and doped to a first conductivity type; a gate structurepositioned above the channel region, the gate structure having a firstpolygonal shape and a second polygonal shape, the first and secondpolygonal shapes overlapping each other at a corner thereof to define aquantum point contact with the channel region; a first doped regionpositioned adjacent to the channel region and doped to a secondconductivity type opposite the first conductivity type, the first dopedregion aligned with a first side of the gate structure and having afirst corner facing the quantum point contact; and a second doped regionpositioned adjacent to the channel region and doped to the secondconductivity type, the second doped region aligned with a second side ofthe gate structure and having a second corner facing the quantum pointcontact, the first and second corners defining a path across the quantumpoint contact and diagonally crossing the channel region; and a metaloxide semiconductor (MOS) transistor.
 14. The integrated circuit ofclaim 13, wherein the first conductivity type is P-type, and the secondconductivity type is N-type.
 15. The integrated circuit of claim 13 ,wherein: the first polygonal shape includes a first rectangular shapehaving a first gate corner; the second polygonal shape includes a secondrectangular shape having a second gate corner overlapping the first gatecorner at the corner to define the quantum point contact with thechannel region.
 16. The integrated circuit of claim 13, furthercomprising: first implants aligned with the first side of the gatestructure along a width direction of the channel region; and secondimplants aligned with the second side of the gate structure along thewidth direction of the channel region.
 17. The integrated circuit ofclaim 16, wherein: the first and second implants are each doped to thefirst conductivity type; and one of the first implants is spaced apartfrom one of the second implants to define a width of the quantum pointcontact.
 18. The integrated circuit of claim 16, wherein: the first andsecond implants are each doped to the second conductivity type; and oneof the first implants connects with one of the second implants to definea width of the quantum point contact.
 19. The integrated circuit ofclaim 13, further comprising: a first lightly doped region extendingfrom the first doped region to the channel region, the first lightlydoped region having a first doping concentration lower than the firstdoped region; and a second lightly doped region extending from thesecond doped region to the channel region, the second lightly dopedregion having a second doping concentration lower than the first dopedregion.
 20. The integrated circuit of claim 19, wherein the first andsecond lightly doped regions are each partially under the gatestructure.
 21. The integrated circuit of claim 13, wherein the quantumpoint contact defines a current path having a width between 5 and 20nanometers.
 22. The integrated circuit of claim 21, wherein the quantumpoint defines a current path having a width of 15 nanometers.
 23. Theintegrated circuit of claim 13, wherein the quantum point contactdefines a current path having a width less than 35 nanometers.